5G is the fifth generation of cellular technology, which can greatly improve the speed, coverage and responsiveness of wireless networks. One of the main features of the 5G network is the possibility to allow many more connections at the same time, at high speeds and with very fast response times.

It will therefore lead to a whole new level of connectivity and communication between devices and objects, making new developments available for smart products, autonomous objects, advanced robotics and public safety functions in smart cities.
All these solutions require the ability to transmit, transfer, manage and process large amounts of data in a short amount of time with low latency.

In the automotive industry, the combination of 5G, IoT and machine learning will not only lead to the development of autonomous driving, but will also provide data on road conditions and allow vehicles to share information with other cars about road conditions, traffic, traffic lights. In the healthcare sector, thanks to telemedicine, patients will be able to be constantly monitored remotely through interconnected devices that will exchange data on key health indicators. Household appliances and catering equipment will be able to start working automatically and perform self-adjusting operations, based on the user's habits and preferences. It will be possible to control their operation remotely, thanks to smart thermostats and smart sensors, or receive reports of failures or malfunctions in real time.

In parallel with the deployment of 5G, the need for more complex printed circuit boards and electronic boards will increase. To accompany this technology, PCBs will need to contain more layers, have higher densities of functionality supported by smaller tracks, distances and hole sizes. We will come to produce boards and circuit boards with very small distances: from 30 microns. That's less than half of what is currently produced. In a very short time we will see a rapid acceleration of technological evolution.

Moore's law, which states that microchip density doubles every two years, is proving to be true. Semiconductors are becoming more and more complex, so an increase in the number of integrated circuit (IC) substrates that serve as connections, is required. These substrates have a very high density, going to support the distribution of electrical energy and signals and dissipating a certain level of heat. In the near future the need will be to have very small semiconductor widths and insulation distances and micrometer hole sizes.